Discrepancies in Nanoindentation Hardness and Modulus with a Berkovich, a Cube-corner, and a Conical Tip in a Cu(In,Ga)Se2 Light-Absorption Layer

In this study, we tried to understand the difference in mechanical properties (elastic modulus, E & hardness, H) values of CIGS compound semiconductors measured using Berkovich indenter and sharper cube corner conical indenter. Adopted continuous stiffness measurement technique characterize it along with indentation depth. The depth was up 1000 nm, H w ere obtained according projected contact area edge calculated assuming two indenters had an ideal shape. case indenter, which is subject comparison, both shape experimental were used. Cube-corner tip showed lower load at same nm compared This means that achieved even a low load, could affect value thin film. cube-corner have sharp about 6 times smaller than tip. It observed not only effect grain boundaries microstructure film, but also reflecting characteristics Mo substrate significant on